A 24 mm x 24 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated

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A 24 mm x 24 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated

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A 24 Mm X 24 Mm Silicon Chip Is Mounted Such That The Edges Are Flush In A Substrate The Substrate Provides An Unheated 1
A 24 Mm X 24 Mm Silicon Chip Is Mounted Such That The Edges Are Flush In A Substrate The Substrate Provides An Unheated 1 (21.61 KiB) Viewed 31 times
A 24 mm x 24 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated starting length of 24 mm that acts as turbulator. Airflow at 25°C (1 atm) with a velocity of 25 m/s is used to cool the upper surface of the chip. If the maximum surface temperature of the chip cannot exceed 75°C, determine the maximum allowable power dissipation on the chip surface. The properties of air at Tf = 75°C+25°C 2 = 50°C are k = 0.02735 W/m-K, v=1.798 x 10-5 m²/s, and Pr = 0.7228.
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