c) Use the SEED's model, if D=4 defects/cm2, (i) What is the yield for: • Chip A: a 1mm by 1mm Chip B: a 7mm by 7mm • Ch

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C Use The Seed S Model If D 4 Defects Cm2 I What Is The Yield For Chip A A 1mm By 1mm Chip B A 7mm By 7mm Ch 1 (26.46 KiB) Viewed 13 times

c) Use the SEED's model, if D=4 defects/cm2, (i) What is the yield for: • Chip A: a 1mm by 1mm Chip B: a 7mm by 7mm • Chip C: a 1.2cm by 1.2cm (ii) How many good chips for “Chip A”, “Chip B” and “Chip C” from a 6” wafer? (iii) If the packaging costs for each” Chip A = £1.5; Chip B = £12 and Chip C = £35. The fabrication* cost of a 6" wafer is £400. Assume that an electronic system can use either 500 Chip A, or 120 Chip B, or 20 Chip C. Which is the most economic solution based on these packaging and processing costs? * Fabrication is a manufacturing process.