An article in the IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1992, Vol. 15) describes an ex

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An Article In The Ieee Transactions On Components Hybrids And Manufacturing Technology 1992 Vol 15 Describes An Ex 1 (39.58 KiB) Viewed 22 times

An article in the IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1992, Vol. 15) describes an experiment for investigating a method for aligning optical chips onto circuit boards. The method involves placing solder bumps onto the bottom of the chip. The experiment used three solder bump sizes and three alignment methods. The response variable is alignment accuracy (in micrometers). The data are as follows: Solder Bump Size Alignment Method (diameter in pm) 1 2 3 75 1.55 1.05 4.64 4.51 1.49 0.95 130 2.29 1.69 0.86 2.49 1.73 0.93 260 5.00 2.73 2.39 4.54 2.55 2.49 (a) Is there any indication that either solder bump size or alignment method affects the alignment accuracy? Is there any evidence of interaction between these factors? Use a = 0.05. The solder bump size the alignment accuracy, the alignment method the alignment accuracy, the interaction between solder size and alignment method significant in affecting alignment accuracy. (b) What recommendations would you make about this process? To improve alignment accuracy, it seems that solder size should be set at um while the alignment method used should be method (c) Analyze the residuals from this experiment. Comment on model adequacy. The assumption of normality reasonable, the assumption of constant variance reasonable.