180 An Array Of Electronic Chips Is Mounted Within A Sealed Rectangular Enclosure And Cooling Is Implemented By Att 1 (38.39 KiB) Viewed 57 times
180 An Array Of Electronic Chips Is Mounted Within A Sealed Rectangular Enclosure And Cooling Is Implemented By Att 2 (62.85 KiB) Viewed 57 times
= 180 ) An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (KAL The base of the heat sink has dimensions of W₁ = W₂ = 100 mm, while the 6 triangular fins are of base-thickness t = 10 mm and pitch S = 18 mm. The side length of the fins is L, = 50 mm, and the base of the heat sink has a thickness of Lp = 10 mm. W m.K m $ If cooling is implemented by water flow through the heat sink, with u = 3 and To= 17°C, using Thermal Resistance method, what is the base temperature T, of the heat sink when power dissipation by the chips is Pelec = 2000 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as kw W = 0.62- Pw = 995 kg mL.K' 77139 Cpw = 4178 Vw = 7.73 x 10-7², and Pr = 5.2. kg.K' S
HAK Lb Water To Electronic- package, W1 Pelec Lf W2 S -Th -Chips Heat Sink
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