(20 points) b) The following figures show two etched patterns on Si wafer. A conductive layer has to be deposited confor

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20 Points B The Following Figures Show Two Etched Patterns On Si Wafer A Conductive Layer Has To Be Deposited Confor 1 (159.42 KiB) Viewed 50 times

(20 points) b) The following figures show two etched patterns on Si wafer. A conductive layer has to be deposited conformally to form electrical connections. (Answer any 2 of the following for undergraduate students) Insulating gap i. Figure: Schematic for conformal conductive layer deposition How will you choose to form these two trenches (wide and narrow)? Will the methods be the same for both trenches? Name and explain your choice of methods. Also answer. If vertical side walls are not needed for the wide trench, what etching would you prefer? What metal amongst the following would you select to deposit a 50 nm thick film (for the electrical connections) and why? o Stainless Steel, A1, Ti 111. What deposition technique would you use for depositing the conductive layer and why? What additional change would you make if you faced adhesion issues? • What deposition technique would be most suitable to deposit metal in the trenches if the substrate was copper instead of Si? iv. How would you generate the insulating gap in between the deposited conductive film?