A 30 mm × 30 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated

[answerhappygod]

A 30 mm × 30 mm silicon chip is mounted such that the edges areflush in a substrate. The substrate provides an unheated startinglength of 30 mm that acts as turbulator. Airflow at 25°C (1 atm)with a velocity of 25 m/s is used to cool the upper surface of thechip. If the maximum surface temperature of the chip cannot exceed75°C, determine the maximum allowable power dissipation on the chipsurface. The properties of air at Tf = 75°C+ 25°C2 = 50°C are k =0.02735 W/m·K, v = 1.798 × 10−5 m2/s, and Pr = 0.7228.
The maximum allowable power dissipation on the chip surfaceis