2. . Protection against moisture is a major concern in IC packaging, since moisture can be one of the most significant c

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2 Protection Against Moisture Is A Major Concern In Ic Packaging Since Moisture Can Be One Of The Most Significant C 1 (55.57 KiB) Viewed 34 times

2. . Protection against moisture is a major concern in IC packaging, since moisture can be one of the most significant contributors to packaging failures in electronic products, degrading their performance and reliability. A plastic encapsulated chip is tested in harsh accelerated aging conditions of 85°C and 85% relative humidity. The purpose of the testing is to determine if the time necessary for the water pick- up until reaching equilibrium in these conditions is at least 6 months long. Determine if the tested chip can pass this test fully i.e. the water pick-up time exceeds with more than 10% the minimal interval of 6 months), can pass it marginally (above the minimal interval of 6 months but with less than 10%) or cannot pass the test. What can be recommended to be changed in order to improve the result for this test? The diffusion constant D for water in the plastic encapsulant is 2 x 10 cm /s and the thickness of the chip's encapsulant is h = 4 mm.