- 2 A Hole Must Be Wet Etched Through A Silicon Wafer That Is 700 Um Thick A Mixture Of Two Parts Of Hc H3o2 Two Parts 1 (23.1 KiB) Viewed 35 times
2. A hole must be wet etched through a silicon wafer that is 700 um thick. A mixture of two parts of HC₂H3O2, two parts
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2. A hole must be wet etched through a silicon wafer that is 700 um thick. A mixture of two parts of HC₂H3O2, two parts
2. A hole must be wet etched through a silicon wafer that is 700 um thick. A mixture of two parts of HC₂H3O2, two parts of 49.2% HF and six parts of 69.5% HNO3 is mixed together to do the etch, (a) How long should the etch take?. (b) The etch is found to take nearly twice as long as predicted. Assuming that the initial concentrations of the proper chemicals are used, list three things that might cause the reduction in the apparent etch rate and what you would do to solve each one..