A 22 mm × 22 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated

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A 22 mm × 22 mm silicon chip is mounted such that the edges are
flush in a substrate. The substrate provides an unheated starting
length of 22 mm that acts as turbulator. Airflow at 25°C (1 atm)
with a velocity of 25 m/s is used to cool the upper surface of the
chip. If the maximum surface temperature of the chip cannot exceed
75°C, determine the maximum allowable power dissipation on the
chip surface.
The properties of air at Tf
= 75°C+25°C275°C⁢+ 25°C2 = 50°C
are k = 0.02735 W/m·K, v =
1.798 × 10−5 m2/s, and Pr = 0.7228.
The maximum allowable power dissipation on the chip surface
is W.