Heat Rejection From A Thermoelectric Cooling Device Is Accomplished Using A 10 X 10 Array Of Dfin 1 5 Mm Diameter Pin 1 (290.92 KiB) Viewed 32 times
Heat rejection from a thermoelectric cooling device is accomplished using a 10 x 10 array of Dfin = 1.5 mm diameter pin fins that are L fin = 15 mm long. The fins are attached to a square base plate that is W = 3 cm on a side and to = 2 mm thick, as shown in the Figure. The conductivity of the fin material is kfin = 70 W/m. K and the thermal conductivity of the base material is kp = 25 W/mK. There is a contact resistance of R'' = 1 x 10-4 m2: /W at the interface between the base of the fins and the base plate. The hot end of the thermoelectric cooler is at Thot = 30 C and the surrounding air temperature is T1 = 20 C. The average heat transfer coefficient between the air and the surface of the heat sink is h = 50 W/m2.K. = T. = 20°C, n = 50 W/m²K 10x10 array of fins kfin = 70 W/m-K fin = +De=1.5 mm Lfin=15 mm ty = 2.0 mm kp=25 W/m-K - W=3.0 cm T = 30°C W R" = 1x10* m-K
Figure 2: (a) What is the total thermal resistance between the hot end of the thermoelectric cooler and the air? (b) What is the rate of heat rejection that can be accomplished under these conditions? (c) Through material selection and manipulation of the air flow across the heat sink, it is possible to affect design changes to kfin and h. Generate a contour plot that illustrates contours of constant heat rejection in the parameter space of kfin (ranging from 5 W/m. K to 150 W/mK) and h (ranging from 10 W m2. K to 200 W/m2 · K).
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