What is Piranha Solution?
Posted: Thu Jul 14, 2022 11:10 am
a) It is a 3:1 to 5:1 mix of nitric acid and hydrogen peroxide that is used to develop the oxide layer on silicon substrate
b) It is a 3:1 to 5:1 mix of sulphuric acid and hydrofluoric acid that is used to clean silicon wafers removing organic and metal contaminants or photo resist after metal patterning
c) It is a 3:1 to 5:1 mix of sulphuric acid and hydrogen peroxide that is used to grow the oxide layer on the silicon
d) It is a 3:1 to 5:1 mix of sulphuric acid and hydrogen peroxide that is used to clean wafers of organic and metal contaminants or photo resist after metal patterning
b) It is a 3:1 to 5:1 mix of sulphuric acid and hydrofluoric acid that is used to clean silicon wafers removing organic and metal contaminants or photo resist after metal patterning
c) It is a 3:1 to 5:1 mix of sulphuric acid and hydrogen peroxide that is used to grow the oxide layer on the silicon
d) It is a 3:1 to 5:1 mix of sulphuric acid and hydrogen peroxide that is used to clean wafers of organic and metal contaminants or photo resist after metal patterning