- The Operations Involved In Additive Manufacturing Of A Pcb Are Normally Arranged In The Following Sequences Select One 1 (46.16 KiB) Viewed 35 times
The operations involved in additive manufacturing of a PCB are normally arranged in the following sequences Select one: O a Preparing the base material (substrate), metallization involving plating resist placement, electroless copper deposition, and plating), striping of plating resist application of solder resist, and trimming the board to sizes Obi Preparing the base material (substrate), making holes, metallization (involving plating resist placement, electroless copper deposition copper and Tin/Lead plating, application of solder resist, and trimming the board to sizes OC Preparing the base material (substrate), making holes, metallization (involving plating tesist placement and plating), striping of plating resist, application of solder resist, and trimming the board to sizes Od Preparing the base material (substrate), making holes, metallization (involving plating resist placement, electroless copper deposition, copper and Tin/Lead plating, striping of plating resist application of solder resist, and trimming the board to sizes The purpose of image Transfer (Image Application or Printing) is for Select one: O a Creating images which could protect the whole board from etching, Plating and soldering Tob. Creating maskant by which the copper laminate or electrical tracks can be easily printed onto a board О с Greating maskant by which the copper laminate or electrical tracks on a board are protected either from etching or plating or soldering or both O d. Creating maskant by which the copper laminate or electrical tracks on a board are protected from following mechanical machining operations