Heat rejection from a thermoelectric cooling device is accomplished using a 10 × 10 array of D_fin = 1.5 mm diameter pin
Posted: Mon May 16, 2022 1:25 pm
Heat rejection from a thermoelectric cooling device is
accomplished using a 10 × 10 array of D_fin = 1.5 mm diameter pin
fins that are L_fin = 15 mm long. The fins are attached to a square
base plate that is W_b = 3 cm on a side and t_b = 2 mm thick,
as shown in the Figure. The conductivity of the fin material is
k_fin = 70 W/m · K and the thermal conductivity of the base
material is k_b = 25 W/mK. There is a contact resistance of R_c = 1
× 10−4 m2 · /W at the interface between the base of the fins and
the base plate. The hot end of the thermoelectric cooler is at
T_hot = 30 C and the surrounding air temperature is T_1= 20 C. The
average heat transfer coefficient between the air and the surface
of the heat sink is h = 50 W/m2 · K.
(a) What is the total thermal resistance between the hot end of
the thermoelectric cooler and the air? (b) What is the rate of heat
rejection that can be accomplished under these conditions? (c)
Through material selection and manipulation of the air flow across
the heat sink, it is possible to affect design changes to k_fin and
h. Generate a contour plot that illustrates contours of constant
heat rejection in the parameter space of k_fin (ranging from 5 W/m
· K to 150 W/mK) and h (ranging from 10 W m2 · K to 200 W/m2 ·
K).
T. = 20°C, h = 50 W/m²K 10x10 array of fins Kfin = 70 W/m-K fin Don=1.5 mm fin=15 mm 4 = 2.0 mm -k=25 W/m-K -W,=3.0 cm Thor = 30°C R* = 1x10 W m-K
accomplished using a 10 × 10 array of D_fin = 1.5 mm diameter pin
fins that are L_fin = 15 mm long. The fins are attached to a square
base plate that is W_b = 3 cm on a side and t_b = 2 mm thick,
as shown in the Figure. The conductivity of the fin material is
k_fin = 70 W/m · K and the thermal conductivity of the base
material is k_b = 25 W/mK. There is a contact resistance of R_c = 1
× 10−4 m2 · /W at the interface between the base of the fins and
the base plate. The hot end of the thermoelectric cooler is at
T_hot = 30 C and the surrounding air temperature is T_1= 20 C. The
average heat transfer coefficient between the air and the surface
of the heat sink is h = 50 W/m2 · K.
- Heat Rejection From A Thermoelectric Cooling Device Is Accomplished Using A 10 10 Array Of D Fin 1 5 Mm Diameter Pin 1 (75.89 KiB) Viewed 41 times
the thermoelectric cooler and the air? (b) What is the rate of heat
rejection that can be accomplished under these conditions? (c)
Through material selection and manipulation of the air flow across
the heat sink, it is possible to affect design changes to k_fin and
h. Generate a contour plot that illustrates contours of constant
heat rejection in the parameter space of k_fin (ranging from 5 W/m
· K to 150 W/mK) and h (ranging from 10 W m2 · K to 200 W/m2 ·
K).
T. = 20°C, h = 50 W/m²K 10x10 array of fins Kfin = 70 W/m-K fin Don=1.5 mm fin=15 mm 4 = 2.0 mm -k=25 W/m-K -W,=3.0 cm Thor = 30°C R* = 1x10 W m-K