- Fundamentals Of Heat Mass Transfer Please Answer Completely 1 (77.38 KiB) Viewed 15 times
Problem 01: 9' T. h Transparent film k=0.02 W.m 'K' Bond T A transparent film needs to be bonded to a substrate by means of a special adhesive. Curing the bond is done by means of a radiant heat source which provides a constant heat flux qm' (Curing is a chemical process in which the adhesive fully crystallizes). The heat flux is fully absorbed at the bonded surface. The bond and bottom surface of substrate temperatures are Tand To, respectively, and the free surface of the film is in contact with atmospheric air at To and a convection heat transfer coefficient h. L Substrate ks = 0.04 W.m 'K To 1) Sketch the thermal circuit for steady state conditions. Label all parts of thermal circuit carefully. 2) We know that due to some construction limitations, the bond temperature (Ti) has to be maintained below 80 °C. So, what is the maximum possible heat flux (9')? Consider following conditions: To = 25 °C, To = 30 °C, and h = 20 W.m-2. K-1.