6. Complete photolithography process sequences for positive and negative photoresists, respectively. (4) Positive PR: Wa

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6 Complete Photolithography Process Sequences For Positive And Negative Photoresists Respectively 4 Positive Pr Wa 1 (81.15 KiB) Viewed 13 times

6. Complete photolithography process sequences for positive and negative photoresists, respectively. (4) Positive PR: Wafer cleaning - -- Develop Negative PR: Wafer cleaning - - Develop 7. Below are different photomasks required for Si microcantilever fabrication process. Explain what each mask is for. (4) A Mask #1 Mask #2 1 TITII III III III III Mask #3 Mask #4 8. Which of the following statements is correct? (2) A. PR thickness depends on its viscosity but not on the spin. B. Primers such as HMDS make inorganic substrates have better adhesion with organic PR. C. Edge bead is an accumulation of PR at the edge of the substrate during spinning and it can be ignored because most of the patterns are made in the center of the substrates. D. PR delamination or cracking due to thermal residual stress is more commonly observed in thin positive PR than in thick negative PR. E. Dry film PR can be used through lamination and the resolution is better than liquid PR.